UT0.25UCRH Ver la hoja de datos (PDF) - Aeroflex UTMC
Número de pieza
componentes Descripción
Lista de partido
UT0.25UCRH Datasheet PDF : 12 Pages
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DIE SIZE (Mils estimate)
245
313
374
426
510
578
642
699
Table 1. Gate Densities
EQUIVALENT USABLE GATES1 SIGNAL I/O2
276,890
160
501,760
216
757,350
265
1,024,000
308
1,524,122
376
2,007,040
431
2,524,058
484
3,029,402
530
Notes:
1. Based on NAND2 equivalents plus 20% routing overhead. Actual usable gate count is design-dependent.
2. Includes five pins that may or may not be reserved for JTAG boundary-scan, depending on user requirements.
POWER & GROUND PADS
48
64
79
92
112
129
144
158
Low-noise Device and Package Solutions
Separate on-chip power and ground buses are provided for in-
ternal cells and output drivers which further isolate internal
design circuitry from switching noise.
In addition, Aeroflex UTMC offers advanced low-noise pack-
age technology with multi-layer, co-fired ceramic construction
featuring built-in isolated power and ground planes (see Table
2). These planes provide lower overall resistance/inductance
through power and ground paths which minimize voltage drops
during periods of heavy switching. These isolated planes also
help sustain supply voltage during dose rate events, thus pre-
venting rail span collapse.
Flatpacks are available with up to 352 leads; PGAs are available
with up to 299 pins and LGAs to 472 pins. Aeroflex UTMC’s
flatpacks feature a non-conductive tie bar that helps maintain
lead integrity through test and handling operations. In addition
to the packages listed in Table 2, Aeroflex UTMC offers custom
package development and package tooling modification servic-
es for individual requirements.
Type
Flatpack
PGA
LGA
Table 2. Packages
Package
68, 84, 132, 172, 196, 256, 304, 340, 352
281, 299
472
Notes:
1. The number of device I/O pads available may be restricted by the selected package.
2. PGA packages have one additional non-connected index pin (i.e., 84 + 1 index pin = 85 total package pins for the 85 PGA).
Contact Aeroflex UTMC for specific package drawings.
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