ADL5390ACPZ-WP Ver la hoja de datos (PDF) - Analog Devices

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ADL5390ACPZ-WP

RF/IF Vector Multiplier

Analog Devices 

OUTLINE DIMENSIONS

ADL5390

4.00

BSC SQ

0.60 MAX

PIN 1

INDICATOR

TOP

VIEW

3.75

BSC SQ

1.00 12° MAX

0.85

0.80

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

0.50

BSC

0.50

0.40

0.30

0.60 MAX

PIN 1

INDICATOR

19

24 1

18

EXPOSED

PA D

(BOTTOMVIEW)

13

6

12

7

2.45

2.30 SQ*

2.15

0.23 MIN

2.50 REF

SEATING

PLANE

0.30

COPLANARITY

0.23 0.20 REF

0.08

0.18

*COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2

EXCEPT FOR EXPOSED PAD DIMENSION

Figure 47. 24-Lead Lead Frame Chip Scale Package [LFCSP]

4 × 4 mm Body

(CP-24-2)

Dimensions shown in millimeters

ORDERING GUIDE

Models

ADL5390ACPZ-WP1, 2

ADL5390ACPZ-REEL71

ADL5390-EVAL

Temperature Range

−40°C to +85°C

−40°C to +85°C

Package Description

24-Lead Lead Frame Chip Scale Package (LFCSP)

24-Lead Lead Frame Chip Scale Package (LFCSP)

Evaluation Board

Package Option

CP-24-2

CP-24-2

Order Multiple

64

1,500

1

1 Z = Pb-free part.

2 WP = waffle pack.

Rev. 0 | Page 23 of 24

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