FEATURES:
·  Chip Outline Dimensions: 68 x 68 mils
·  Chip Thickness: 8 to 12 mils
·  Anode Metallization: Aluminum
·  Metallization Thickness: 70,000ÃNominal
·  Bonding Area: 42 x 42 mils Min.
·  Back Metallization: Gold-3000ÃNominal
·  Junction Passivated with Thermal Silicon Dioxide - Planar Design
·  Backside Available with Solderable Ag Backside as JANHCF or JANKCF