FEATURES
◾ Access Times 15, 17, 20, 25, 35, 45, 55ns
◾ MIL-STD-883 Compliant Devices Available
◾ Revolutionary, Center Power/Ground Pinout JEDEC
   Approved
◾ 36 lead Ceramic SOJ (Package 100)
◾ 36 lead Ceramic Flat Pack (Package 226)
◾ Evolutionary, Corner Power/Ground Pinout JEDEC
   Approved
◾ 32 pin Ceramic DIP (Package 300)
◾ 32 lead Ceramic SOJ (Package 101)
◾ 32 lead Ceramic Thinpack™ Flat Pack
   (Package 321)
◾ 32 pin, Rectangular Ceramic Leadless Chip
   Carrier (Package 601)
◾ Commercial, Industrial and Military
   Temperature Range
◾ 5V Power Supply
◾ Low Power CMOS
◾ Low Power Data Retention for Battery Back-up
   Operation
◾ TTL Compatible Inputs and Outputs