Description
BGF125 is an ESD protection and filtering circuit for SIM card interfaces. All external IOs are protected against ESD pulses of ±15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green lead-free and halogen-free package with a size of only 1.15 mm x 1.15 mm and a total height of 0.6 mm

FEATUREs
• ESD protection circuit and interface filter for SIM cards
• Reduced line capacitance of 12 pF maximum
• ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on external IOs
• Wafer level package with SnAgCu solder balls
• 400 µm solder ball pitch
• RoHS and WEEE compliant package