The C2955 is an IC internal inspection system incorporating an infrared microscope and an infrared CCD camera. Use of a newly developed infrared CCD camera enables a high sensitivity approximately ten times that of conventional systems (in comparisons by HAMAMATSU), at a wavelength of 1.0 µm, making it possible to obtain sharp, clear images with high resolution.

● Best suited for flip-chip evaluation
● No damage to part under observation
● High sensitivity, high resolution
● Built-in contrast enhancement function
● Shading correction function

APPLICATIONS
• Inspection of flip-chip and other packaged IC devices
• Testing for abnormalities (defects, failures) in metal and polysilicon wiring
• Observation of wire bonding
• Observation of various types of die bonding zones
• Simultaneous inspection of Al-Si nodules and multiple patterns
• Observation of pattern diffusion into substrate
• Identification of ESD failure locations