DB1508P Hoja de datos - DIOTEC Electronics Corporation
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DB1508P
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DIOTEC Electronics Corporation
FEATURES
• VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
• BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE
• INTEGRALLY MOLDED HEAT SINK PROVIDES VERY LOW THERMAL RESISTANCE FOR MAXIMUM HEAT DISSIPATION
• UL RECOGNIZED - FILE #E141956
• RoHS COMPLIANT
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