FP15R06W1E3_B11 Hoja de datos - Infineon Technologies
Número de pieza
FP15R06W1E3_B11
componentes Descripción
Other PDF
PDF
page
12 Pages
File Size
637.9 kB
Fabricante
Infineon Technologies
Electrical Features
• Low Switching Losses
• Low VCEsat
• Trench IGBT 3
• VCEsat with positive Temperature Coefficient
Mechanical Features
• Al2O3 Substrate with Low Thermal Resistance
• Compact design
• PressFIT Contact Technology
• Rugged mounting due to integrated mounting
clamps
Typical Applications
• Auxiliary Inverters
• Air Conditioning
• Motor Drives
Número de pieza
componentes Descripción
PDF
Fabricante
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT/NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC
Infineon Technologies
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Infineon Technologies
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