FEATURES
• Glass passivated chip junction
• Low forward voltage drop
• Low leakage current, typical IR less than 0.1 μA
• High forward surge capability
• Meets environmental standard MIL-S-19500
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• Compliant to RoHS directive 2002/95/EC and in
   accordance to WEEE 2002/96/EC

TYPICAL APPLICATIONS
   For use in general purpose rectification of power supplies, inverters, converters and freewheeling diodes application.