HP6-189S-1.27DS Hoja de datos - HIROSE ELECTRIC
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HP6-189S-1.27DS
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34 Pages
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1.2 MB
Fabricante
HIROSE ELECTRIC
High-density Packaging System
Connectors for Hi-PAS Mounting
Overview
The HP5 Series and C-G Series of Hi-PAS (High-density Packaging System) mounting connectors were developed to meet the demands of the high performance and trend toward high-density packaging of communications equipment.
APPLICATIONs
Exchange equipment, transmission equipment, measuring instruments, control equipment, etc.
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