HVL144AM(2006) Hoja de datos - Renesas Electronics
Número de pieza
HVL144AM
componentes Descripción
Other PDF
PDF
page
6 Pages
File Size
148.8 kB
Fabricante
Renesas Electronics
Features
• Adopting the trench structure improves low capacitance.(C = 0.43 pF max)
• Low forward resistance. (rf = 1.8 Ω max)
• Low operation current.
• Thin Extremely small Flat Lead Package (TEFP) is suitable for surface mount design.
Número de pieza
componentes Descripción
PDF
Fabricante
Silicon Epitaxial Trench Pin Diode for Antenna Switching ( Rev : 2006 )
Renesas Electronics
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