Description
Third Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device for use in a wide variety of applications.
The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides he highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRFZ48L) is available for low-profile applications.

   Advanced Process Technology    VDSS=60V
   Surface Mount (IRFZ48S)            RDS(on)=0.018Ω
   Low-profile through-hole (IRFZ48L)
   175℃ Operating Temperature      ID=50A ⑥
   Fast Switching