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PBSS5330PAS Hoja de datos - Nexperia B.V. All rights reserved

PBSS5330PAS image

Número de pieza
PBSS5330PAS

Other PDF
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page
18 Pages

File Size
671.5 kB

Fabricante
NEXPERIA
Nexperia B.V. All rights reserved NEXPERIA

General description
PNP low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and soldarable side pads.

NPN complement: PBSS4330PAS


FEATUREs and benefits
• Low collector-emitter saturation voltage VCEsat
• High collector current capability IC and ICM
• High collector current gain (hFE) at high IC
• High efficiency due to less heat generation
• High temperature applications up to 175 °C
• Reduced Printed-Circuit Board (PCB) area requirements
• Leadless small SMD plastic package with soldarable side pads
• Exposed heat sink for excellent thermal and electrical conductivity
• Suitable for Automatic Optical Inspection (AOI) of solder joint
• AEC-Q101 qualified


APPLICATIONs
• Loadswitch
• Battery-driven devices
• Power management
• Charging circuits
• Power switches (e.g. motors, fans)


Número de pieza
componentes Descripción
PDF
Fabricante
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Ver
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