SB400L Hoja de datos - DIOTEC Electronics Corporation
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SB400L
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DIOTEC Electronics Corporation
FEATURES
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIP ATION (Solder V oids: T ypical < 2%, Max. < 10% of Die Area)
BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE
SURGE OVERLOAD RA TING TO 200 AMPS PEAK
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