Fabricante
Chip Integration Technology Corporation
Features
• Electrostatic discharge (ESD) test under IEC6100-4-2
standard >16ΚV(SK12A~SK16A).
standard >10ΚV(SK110A~SK120A).
• Low profile surface mounted application in order to
optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Suffix "G" indicates Halogen-free part, ex.SK12AG.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Mechanical data
• Case : Molded plastic, DO-214AC / SMA
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Weight : 0.002 ounce, 0.055 gram
• Epoxy:UL94-V0 rated flame retardant
Número de pieza
componentes Descripción
PDF
Fabricante
1A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
1A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
1A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
1A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
1A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
1A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS
Frontier Electronics.
1A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
1A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
1A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
1A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS
Frontier Electronics.