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HS-80C86RH(1995) Ver la hoja de datos (PDF) - Intersil

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HS-80C86RH
(Rev.:1995)
Intersil
Intersil Intersil
HS-80C86RH Datasheet PDF : 37 Pages
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HS-80C86RH
Intersil Space Level Product Flow - Q
All Lots - Wafer Lot Acceptance (Including SEM)
Method 5007
Each Wafer - GAMMA Radiation Verification,
Two samples/wafer, 0 rejects, Method 1019
100% Nondestructive Bond Pull, Method 2023
Sample - Wire Bond Pull Monitor, Method 2011
Sample - Die Shear Monitor, Method 2019 or 2027
100% Internal Visual Inspection, Method 2010, Condition A
100% Temperature Cycle - Method 1010, Condition C,
10 cycles
100% Constant Acceleration, Method 2001, Condition
Per Method 5004
100% Interim Electrical Test 1 (T1)
100% Delta Calculation (T0-T1)
100% PDA 1, Method 5004 (Note 1)
100% Dynamic Burn-In, Condition D, 240 hours, +125oC or
Equivalent Per Method 1015
100% Interim Electrical Test 2 (T2)
100% Delta Calculation (T0-T2)
100% PDA 2, Method 5004 (Note 2)
100% Final Electric Test (T3)
100% Fine/Gross Leak, Method 1014
100% Radiographic, Method 2012 (Note 3)
100% PIND - Method 2020, Condition A
100% External Visual, Method 2009
100% External Visual
Sample - Group A, Method 5005 (Note 4)
100% Serialization
Sample - Group B, Method 5005 (Note 5)
100% Initial Electrical Test (T0)
Sample - Group D, Method 5005 (Notes 5, 6)
100% Static Burn-In 1, Method 1015, Condition A or B,
72 Hours Minimum, 125oC minimum
NOTES:
100% Data Package Generation (Note 6)
1. Modified SEM Inspection, not compliant to MIL-STD-883, Method 2018. This device does not meet the Class S minimum metal step cov-
erage of 50%. The metal does meet the current density requirement of <2 E5 A/cm2. Data provided upon request.
2. Failures from subgroups 1, 7 and deltas are used for calculating PDA. The maximum allowable PDA = 5% with no more than 3% of the
failures from subgroup 7.
3. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004.
4. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005.
5. Group B and D inspections are optional and will not be performed unless required by the P.O. When required, the P.O. should include
separate line items for Group B test, Group B samples, Group D tests and Group D samples.
6. Group D Generic Data, as defined by MIL-I-38535, is optional and will not be supplied unless required by the P.O. When required, the
P.O. should include separate line items for Group D generic data. Generic Data is not guaranteed to be available and is therefore not
available in all cases.
7. Data Package Contents:
• Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number, Quan-
tity). Wafer Lot Acceptance Report (Method 5007) to include reproductions of SEM photos with percent of step coverage.
• GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, test package used, specification numbers, test
equipment, etc. Radiation Read and Record data on file at Intersil.
• X-Ray Report and Film, including penetrameter measurements.
• Lot Serial Number Sheet (Good Unit(s) Serial Number and Lot Number).
• Variables Data (All Delta operations). Data is identified by serial number. Data header includes lot number and date of test.
• Group B and D attributes and/or Generic data is included when required by P.O.
• The Certificate of Conformance is a part of the shipping invoice and is not part of Data Book. The Certificate of Conformance
is signed by an authorized Quality Representative.
Spec Number 518055
883

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