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CB35000
ST-Microelectronics
STMicroelectronics ST-Microelectronics
CB35000 Datasheet PDF : 16 Pages
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CB35000 SERIES
Table 4 Temperature (Junction) and Voltage
Multipliers
Temperature oC
KT
-55
0.77
-40
0.83
25
1.00
70
1.13
85
1.17
125
1.27
VDD
KV
2.7
1.20
3.0
1.11
3.3
1.00
3.6
0.94
Inside the slew rate sections the next slices of
specialized designed components step on a 50
micron wide pattern. The first of these 50 micron
wide sections is utilized for predriver circuits;
these include specialized built in test functions for
the I/O. The predriver of course interfaces the
core signals controlling tristate and switching
functions with the slew rate and output transistor
sections but it also allows all Output Buffers to be
driven high, low or put into tristate regardless of
the state of the internal logic greatly simplifying
parametric testing of the part and also assisting
customers who wish to use this feature during
board testing. Note that all output buffers can be
tristated by this function including buffers that
normally do not tristate. This test function also
turns off all pull up or down devices and shuts
down all differential receivers and converts them
into standard CMOS receivers. Inside the
predriver is a section of specialized transistors
used to create the receiver functions. This
section includes specialized non salicide
protection resistor diodes to further protect the
gates of the receiver devices from ESD and latch
up. Also present in this section are devices that
can be utilized to form various parameteriseable
pull up, pull down and buskeeper functions. A full
set of standard receivers with pull up and pull
6/16
®
down devices is present in the library. The
technologies supported match the output buffer
capabilities and include, LVCMOS, LVTTL, GTL,
CTL, Differential, etc. and a five volt interface
capability.
All pads except the sixteen corner pads can be
configured as power or I/O pads. The configured
power pads are known as placeable pads and
have an associated current handling capability.
Their placement is dependent on the types of
output buffers used in the design. For rules
governing the placement of pads, please contact
your local SGS-THOMSON design centre.
CORE LOGIC
The propagation delays shown in the CB35000
data book are given for nominal processing, 3.3V
operation, and 25 C temperature conditions.
However there are additional factors that affect
the delay characteristics of the macrocells. These
include loading due to fanout and interconnect
routing, voltage supply, junction temperature of
the device, processing tolerance and input signal
transition time. Prior to physical layout, the
design system can estimate the delays
associated with any critical path. The impact of
the placement and routing can be accurately RC
back annotated from the layout for final
simulations of critical timing. The effects of
junction temperature, (KT) and voltage supply
(KV) on the delay numbers are summarized in
Table 4. A third factor, is associated with process
variation. This multiplier has a minimum of 0.8
and a maximum of 1.2.
MACROCELLS AND MACROFUNCTIONS
The CB35000 series has internal macrocells that
are robust in variety and performance. The cell
selection has been driven by the need of
Synthesis and HDL based design techniques.
This offering is rich in buffers, complex
combinatorial cells and multi power drive cells,
which allow the Synthesis tool to create a netlist
compatible with the requirements of Place and
Route tools.
Macrofunctions are a series of soft-macros
facilitating quick capture of large functional blocks
and are available for such functions as counters,

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