ESDA18-1F2 Ver la hoja de datos (PDF) - STMicroelectronics
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ESDA18-1F2 Datasheet PDF : 8 Pages
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ESDA18-1F2
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Ordering information scheme
Ordering information scheme
Figure 10. Ordering information scheme
ESDA 18 - 1 Fx
ESD Array
Breakdown Voltage
18 = 18 Volts max.
Number of line
1 = signle line
Package
F = Flip Chip
x = 2: Lead-free, pitch = 500 µm, bump = 315 µm
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Packing information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 11. Flip Chip package dimensions
500 µm ± 50
315 µm ± 50
650 µm ± 65
225 µm
0.92 mm ± 30 µm
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