ESDA18-1F2 Ver la hoja de datos (PDF) - STMicroelectronics

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ESDA18-1F2

Transil™, transient voltage suppressor

STMicroelectronics 

Packing information

Figure 12. Footprint recommendations Figure 13. Marking

ESDA18-1F2

Copper pad Diameter:

250 µm recommended, 300µm max

Solder stencil opening: 330 µm

Solder mask opening recommendation:

340 µm min for 315 µm copper pad diameter

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

E

xxz

y ww

Figure 14. Flip Chip tape and reel specification

Dot identifying Pin A1 location

4 ± 0.1

Ø 1.5 ± 0.1

1.0

Note:

0.73 ± 0.05

4 ± 0.1

All dimensions in mm

User direction of unreeling

More packing information is available in the application notes:

AN1235: “Flip Chip: Package description and recommendations for use”

AN1751: "EMI Filters: Recommendations and measurements"

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