Test condition
   Varistor voltage                                             In = 1 mA DC
   Leakage current                                           Vdc =14V DC
   Maximum clamping voltage                          Ic = 1 A
   Rated peak single pulse transient current    8 / 20 ㎲ waveform, ?- each 1 time induce
   Capacitance                                                 10/1000 ㎲ waveform
   Insulation resistance after reflow soldering  f = 1MHz, Vrms = 0.5 V
                                                               Soldering paste : Tamura (Japan) RMA-20-21L
                                                               Stencil : SUS, 120 ㎛ thickness
   Reflow soldering condition     Pad size : 0.8 (Width) x 0.9 (Length)
                                                                   0.8 (Distance between pads)
                                                  Soldering profile : 260± 5 ℃ , 5 sec.