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SC18IM700 Datasheet PDF : 24 Pages
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NXP Semiconductors
SC18IM700
Master I2C-bus controller with UART interface
4. Ordering information
Table 1. Ordering information
Type number
Topside
marking
SC18IM700IPW
IM700 B
SC18IM700IPW/S8 IM700 B
Package
Name
TSSOP16
TSSOP16
Description
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
Version
SOT403-1
SOT403-1
4.1 Ordering options
Table 2. Ordering options
Type number
Orderable part number
SC18IM700IPW SC18IM700IPW,112[1]
SC18IM700IPW,128[1]
SC18IM700IPW/S8 SC18IM700IPW/S8HP[2][3]
Package Packing method
TSSOP16
STANDARD
MARKING * IC'S
TUBE - DSC BULK
PACK
TSSOP16 REEL 13" Q2/T3
*STANDARD MARK
SMD
TSSOP16 REEL 13" Q2/T3
*STANDARD MARK
SMD
Minimum Temperature
order
quantity
2400
Tamb = 40 C to +85 C
2500
Tamb = 40 C to +85 C
2500
Tamb = 40 C to +85 C
[1] Discontinued 201706009DN with Last Time Buy 12/7/2018 and Last Time Ship 6/6/2019.
[2] NXP plans to supply the /S8 device which is identical to the discontinued device for a minimum of 7 years with an expected
discontinuation in the 2024-2025 timeframe, but in the meantime, Failure Analysis for /S8 devices will consist of Automated Test
Equipment (ATE) and electrical overstress verification along with package and wire bond validation only. Detailed device failure analysis
will not be available; refer to CIN 201708035I.
[3] The ",128" packing code for tape and reel with pin 1 in Q2 is now "HP".
5. Block diagram
SC18IM700_3
Product data sheet
VDD
VSS
RX
TX
RESET
WAKEUP
SC18IM700
UART
Fig 1. Block diagram of SC18IM700
I2C-BUS
CONTROLLER
GPIO
REGISTER
002aab743
SDA
SCL
8
GPIOs
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 12 October 2017
© NXP Semiconductors N.V. 2017. All rights reserved.
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