Device Highlight
Flexible Programmable Logic
• .25 µm five layer metal CMOS Process
• 2.5 V VCC, 2.5 V/3.3 V Drive Capable I/O
• 3,072 Logic Cells
• 488,064 Max System Gates
• 444 I/O Pins

Embedded Dual Port SRAM
• Thirty-two 2,304-bit Dual Port High Performance SRAM Blocks
• 73,728 RAM Bits
• RAM/ROM/FIFO Wizard for Automatic Configuration
• Configurable and Cascadable

Programmable I/O
• High performance Enhanced I/O (EIO)—less than 3 ns Tco
• Programmable Slew Rate Control
• Programmable I/O Standards:
• LVTTL, LVCMOS, PCI, GTL+, SSTL2, and SSTL3
• Eight Independent I/O Banks
• Three Register Configurations: Input, Output, and Output Enable

Advanced Clock Network
• Nine Global Clock Networks:
   • One Dedicated
   • Eight Programmable
• 20 Quad-Net Networks—five per Quadrant
• 16 I/O Controls—two per I/O Bank
• Four phase locked loops

Embedded Computation Units
   ECUs provide integrated Multiply, Add, and Accumulate Functions.