CB55000 Ver la hoja de datos (PDF) - STMicroelectronics

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CB55000

HCMOS7 Standard Cells

STMicroelectronics 

CB55000 Series

Figure 6. CB55Q Silicon ring oscillator characterization

CB 55Q S ilicon

Ring Os c illator Characteriz ation

9 ,0 0 E + 0 1

8 ,0 0 E + 0 1

7 ,0 0 E + 0 1

6 ,0 0 E + 0 1

5 ,0 0 E + 0 1

4 ,0 0 E + 0 1

3 ,0 0 E + 0 1

2 ,3

2 ,4

2 ,5

2 ,6

2 ,7

Vdd (Volt)

ND2

NR2

IV

6 PACKAGE AVAILABILITY

The CB55000 Series is designed so that it can be made compatible with all types of traditional (PLCCs, PQFPs)

surface mount packages and also more advanced BGAs and Low Profile BGAs. The main packaging options

include:

Plastic Leaded Chip Carriers (PLCC) up to 84 pins, Metric Quad Flat Pack (xQFP) thin and standard, up to 208

pins including high power dissipation versions with slug or spreader.

Ball Grid Array package family:

Plastic BGA, 1.27mm ball pitch

from 208 to 456 pins

High performance BGA, 1.27mm ball pitch

from 168 to 640 pins

Flip-Chip BGA, 1.27 or 1mm ball pitch

from 352 to1000 pins

Low profile BGA, 1mm ball pitch

from 144 to 256 pins

Low profile Fine pitch BGA. 8mm ball pitch

from 36 to 180 pins

Ultra Fine pitch BGA .5mm ball pitch

from 40 to 304 pins

The diversity in pin count and package style gives the designer the opportunity to find the best compromise for

system size, cost and performances requirements.

10/15

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